MSBond Epoxies

MS130 is a room temperature curing epoxy with high thermal conductivity and excellent electrical insulation properties - for applications up to 170C. MS130, thermally conductive compound, is specially formulated for high temperature use, for the encapsulation and potting of electronic components and assemblies. MS130 is a highly filled system and contains aluminum oxide in laminar crystallographic form to achieve high thermal conductivity. Due to the excellent heat transfer of MS130, the dissipation of heat generated by the potted component is assured. In addition to high thermal conductivity, there is great adhesion; extremely low coefficient of expansion and no shrinkage upon curing. 

MS752 is a tough, flexible, 100% solids epoxy compound specially formulated for use as a potting resin. Among its many applications, MS-752 can be used to insulate and protect electronic components or to reproduce both large and small castings. It remains resilient even after final cure is achieved. Highly resistant to acids, solvents, caustics, hydrocarbons, salt water, fresh water, excellent impact and abrasion resistance. MS-752 can be injected or poured as a potting resin with virtually no shrinkage and relatively low exothermic heat generation.